EDA業內矚目的年度活動Cadence用戶大會CDNLive將于2012年8月9日于北京香格里拉酒店召開，主辦方擬邀請400家客戶參加大會，本土最大分銷商科通集團作為Cadence中國區最大增值代理商，將以贊助商名義參加大會，演示代理的Cadence PCB全線(Allegro和OrCAD)產品，幫助本土工程師利用高級EDA軟件加速產品設計。
科通集團自2011年1月1日起正式與Cadence公司開展分銷合作，科通集團在中國區授權分銷Cadence的OrCAD 及Allegro全線產品?？仆ìF已擁有包括Microsoft、Intel、Panasonic、Freescale 、Xilinx、SanDisk、Linear及Broadcom等在內的多條產品線，在無線通信、電信設備、企業網絡、數字媒體、家庭娛樂、汽車電子、工業控制等領域擁有很高的市場份額。深圳、香港、北京、上海、南京、武漢、西安、成都、廈門等多個分公司及辦事處構成了覆蓋全國的銷售和服務網絡，有超過500名高素質員工為國內的OEM廠商、ODM廠商和EMS廠商提供范圍廣泛的電子元器件銷售及方案提供服務。
Cadence用戶大會至今已經舉辦7屆，每年的Cadence用戶大會關注EDA領域的年度熱點，以論文演講、技術演示、趨勢演講、產品演示的方式全面展示EDA領域的最新技術和方案，大會也提供了交流的平臺，方便與會者交流設計心得、解決設計難題。
2012年度Cadence用戶大會將于2012年8月9日在北京香格里拉酒店舉行。本次年會聚集了Cadence技術用戶、開發商和業內專家。與會者將從業內同仁處了解應對未來電子設計挑戰的新思路和解決方案。也可以通過論文演講與其他地區的半導體設計者分享重要設計與驗證問題的解決經驗，并為實現高級晶片、SoC和系統發現新技術。
本次年度大會為免費活動，歡迎業內人士踴躍報名，在線注冊地址：
http://www.cadence.com/cn/cadence/events/Pages/registration.aspx?eventid=106
如有任何疑問，請發送郵件至event_cn@cadence.com
會議日程安排：（2012年8月9日, 星期四）
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08:30-09:00 |
Registration and morning light breakfast |
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09:00-09:05 |
Opening Ceremony |
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James Liu, GM & VP sales, Cadence Design Systems |
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09:05-09:25 |
Keynote: Opportunities, Challenges, and Collaboration |
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Lip-Bu Tan, President and CEO, Cadence Design Systems |
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09:25-09:50 |
Keynote presentation |
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Dr. Wei Shaojun, Director, Institute of Microelectronics, Tsinghua University |
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09:50-10:15 |
Keynote: Realizing Best Performance, Power, Area, and Yield for the 2x Nanometer Era |
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Chi-Ping Hsu, Senior VP R&D, Cadence Design Systems |
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10:15-10:30 |
Morning Break |
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(Demo booth & Exhibition open) |
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10:30-11:55 |
Panel discussion (Theme: Aggregate or Disaggregate? Chinese semiconductor industry trend in the next 10 years) |
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Moderator: Charlie Huang, Senior VP, Worldwide Field Operations, Cadence Design Systems; 6 key executive panelists from China IC Ecosystem |
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11:55-12:00 |
Best Paper Award Ceremony |
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12:00-13:00 |
Lunch |
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(Demo booth open during 12:30-13:00) |
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Digital |
Custom/Analog |
System Design & Functional Verification |
IC Packaging and PCB Design |
Design & Verification IP |
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13:00-13:30 |
D-01 Encounter RTL-to-Signoff technology overview and roadmap --Cadence |
C-01 Custom Design And Simulation (CAS) Technology Overview --Cadence |
S-01 Functional Verification Overview --Cadence |
P-01 PCB and IC Packaging Technology Overview including Introduction of Sigrity Technology --Cadence |
I-01 Design & Verification IP technology overview --Cadence |
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13:30-14:00 |
D-02 Cadence Silicon Signoff and Verification Solutions Update--Cadence |
C-02 PVS: design and signoff with confidence--Cadence |
S-02 Next generation SoC co-development with Cadence’s System Development Suite--Cadence |
I-02 Reducing IC size, power and cost through early chip planning --Cadence |
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14:00-14:25 |
D-03 Customer Presentation --ARM |
C-03 Block and Chip level AMS Designer verification --NationalZ |
S-03 A comprehensive approach to scalable Framework for both vertical and horizontal reuse in UVM verification --AMD |
P-02 A new Methodology of Power Design and Analysis with Allegro PCB PDN --Ericsson |
I-03 customer presentation --ZTE |
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14:25-14:50 |
D-04 The implementation of Smartphone chip including Cortex TM-A5 core at Cadence Platform --Spreadtrum |
C-04 Using RelXpert to do performance degradation and lifetime simulation on mos device --Analogix |
S-04 Best Practice of Wreal Based Analog Modeling --LSI |
P-03 Building a PCB design quality assurance system —Huawei |
I-04 Customer presentation --Brite Semi |
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科通集團是中國本土最大、成長最快、關注增值服務的電子元器件及方案提供商，與全球主要的領先半導體供應商緊密合作，例如Broadcom、Xilinx、Freescale、Linear、Atmel、Intel、Microsoft、Sandisk等等，致力于為國內的OEM廠商、ODM廠商和EMS廠商提供范圍廣泛的電子元器件和技術支持服務,應用涉及智能手機、消費電子、工控醫療、汽車及智能交通系統、網絡通信等眾多領域。歡迎聯絡科通集團各地辦事處，總部電話：0755-26743210，如需了解更多信息，請訪問科通集團網站：www.comtech.com.cn，或關注科通官方微博：@comtech科通.